Introducing ENIG-Premium TM
Resolve reliability concerns & field failures due to Electroless Nickel Immersion Gold (ENIG)


  Eco-friendly solution: Cyanide-free chemistry
  Improves corrosion resistance by a factor of 10
  No brittle failures at solder joints
  Up to 40% savings in gold material consumption
  Adaptable to fit your existing assembly process




Conventional ENIG assemblies suffer from several known issues:
Corrosion ("black pad" defects), non-wetting to solder
Brittle failures at solder joints, component breakage
Non-uniform gold thickness, more expensive and less reliable
Over-plating or skip-plating issues on PCBs

LiloTree offers the revolutionary solution ENIG-Premium TM (Patents Pending)


Improved reliability with all the benefits of the traditional ENIG.
An Eco-friendly surface finish solution, while retaining all the benefits of the traditional ENIG processes.
Seamless adoption by any PCB manufacturer. Our chemistry requires no change in base assembly processes.
Similar process. Our Chemistry. Lower Costs. Better Reliability. Eco-Friendly.

LiloTree received a Small Business Innovation Research (SBIR) grant from the National Science Foundation to develop ENIG-Premium TM to resolve the field failures where black pads and brittle failures at solder joints were found to be factors contributing to the malfunctioning of devices (NSF SBIR Phase I & NSF SBIR Phase II)


Manufacturing in US (Washington State)

Agile in filling purchase orders

Fully functional & comprehensive scientific lab in-house

Team of experienced application engineers


Contact us for more information or to qualify ENIG-PremiumTM for your electronic assemblies



LiloTree Office:
17371 NE 67th Court,
Building B, Suite 209,
Redmond WA 98052-4969
Phone: 425-780-2732

Email: contact.us@lilotree.com
LiloTree Manufacturing:
2904 266th Ave NE,
Redmond WA, 98053-2936