LiloTree offers various surface finish solutions for better plating performance

Nanocleaner & Lilo-Pretreat


Introducing Award-Winning Ni-less ENIG-PremiumTM 
Nickel-Free Surface Finish Solution for HDI, 5G, High Frequency, RF PCB applications
Tremendous growth in mobile phones/devices, 5G network has led to enormous increase in amount of data transfer.
For HDI, high frequency applications, high speed electronic signals are necessary in PCBs. To achieve the optimum performance and reliability LiloTree has launched revolutionary, unparalleled solution: Ni-less ENIG-Premium.

Ni-less ENIG-Premium

  Nickel-less solution: Low insertion loss

 High reliability: No brittle failures at solder joints (including Lead-free)

 Long shelf life: Au based surface finish

 Cost-effective: Lower gold thickness (50 nm vs. 200 nm - EPIG, EPAG and DIG)

 Eco-friendly solution: (Cyanide-free & RoHS compliant)

ENIG-Premium (Patented)
Reliability with a rose-gold shine

Resolve reliability concerns & field failures due to Electroless Nickel Immersion Gold (ENIG)
  Eco-friendly solution: Cyanide-free rose-gold shine
  ENIG-Premium Black Pad Newsletter Improves corrosion resistance by a factor of 10
  No brittle failures at solder joints
  Up to 40% savings in gold material consumption vs ENIG and ENEPIG 
  Adaptable to fit your existing assembly process

Conventional ENIG and ENEPIG assemblies suffer from several known issues:
  Corrosion ("black pad" defects), non-wetting to solder
  Brittle failures at solder joints, component breakage
  Non-uniform gold thickness, more expensive and less reliable
  Over-plating or skip-plating issues on PCBs 

Leave behind the cyanide-based matte yellow finishes!

ENIG-Premuim™ PCB Surface Finish Demo

Improved reliability with all the benefits of the traditional ENIG.
An Eco-friendly surface finish solution, while retaining all the benefits of the traditional ENIG processes.
Seamless adoption by any PCB manufacturer. Our chemistry requires no change in base assembly processes.

Your process - Our Chemistry - Better Reliability

LiloTree received a Small Business Innovation Research (SBIR) grant from the National Science Foundation to develop ENIG-Premium TM to resolve the field failures where black pads and brittle failures at solder joints were found to be factors contributing to the malfunctioning of devices (NSF SBIR Phase I & II)
LiloTree received 2019 Best of Redmond Award in the Manufacturer category

Manufacturing in US (Washington State)

Agile in filling purchase orders

Fully functional & comprehensive scientific lab in-house

Team of experienced application engineers

Contact us for more information or to qualify ENIG-PremiumTM for your electronic assemblies.
Other Services
Product Improvement Solutions

Product Improvement Solutions

Product Improvement Solutions
Failure Analysis and Solution: We provide root cause identification to every malfunctions and failures experienced by customers' parts or components.
Quality Compliance: Our scientists will provide quality compliance testing for wide range of products from various industries.
Manufacturing consultation: We provide support for all aspects of product development cycle: R&D, Manufacturing, Quality Compliance and Failure Analysis.
2904 266th Ave NE,
Building B, 
Redmond WA 9803-2936 
Phone: 425-780-2732