Tremendous growth in mobile phones/devices, 5G network has led to enormous increase in amount of data transfer.
For HDI, high frequency applications, high speed electronic signals are necessary in PCBs.To achieve the optimum performance and reliability LiloTree has launched revolutionary, unparalleled solution: Ni-less ENIG-Premium.
Ni-less ENIG-Premium
Nickel-less solution: Low insertion loss
High reliability: No brittle failures at solder joints (including Lead-free)
Resolve reliability concerns & field failures due to Electroless Nickel Immersion Gold (ENIG)
Eco-friendly solution: Cyanide-free rose-gold shine Improves corrosion resistance by a factor of 10 No brittle failures at solder joints Adaptable to fit your existing assembly process
Up to 40% savings in gold material consumption vs ENIG and ENEPIG
Conventional ENIG and ENEPIG assemblies suffer from several known issues:
Corrosion ("black pad" defects), non-wetting to solder Brittle failures at solder joints, component breakage Non-uniform gold thickness, more expensive and less reliable
Over-plating or skip-plating issues on PCBs
Leave behind the cyanide-based matte yellow finishes!
ENIG-Premuim™ PCB Surface Finish Demo
Improved reliability with all the benefits of the traditional ENIG.
An Eco-friendly surface finish solution, while retaining all the benefits of the traditional ENIG processes.
Seamless adoption by any PCB manufacturer. Our chemistry requires no change in base assembly processes.
Your process - Our Chemistry - Better Reliability
LiloTree received a Small Business Innovation Research (SBIR) grant from the National Science Foundation to develop ENIG-Premium to resolve the field failures where black pads and brittle failures at solder joints were
found to be factors contributing to malfunctioning of devices (NSF SBIR Phase I & II)
LiloTree received 2019 Best of Redmond Award in the Manufacturer category
Corrosion ("black pad" defects), non-wetting to solder 
