Tremendous growth in mobile phones/devices, 5G network has
led to enormous increase in amount of data transfer.
For HDI, high frequency applications, high
speed electronic signals are necessary in PCBs.To achieve the optimum
performance and reliability LiloTree has launched revolutionary, unparalleled solution: Ni-less
ENIG-Premium.
Ni-less ENIG-Premium
Nickel-less
solution: Low insertion loss
High
reliability: No brittle failures at solder joints (including Lead-free)
Long
shelf life: Au based surface finish
Cost-effective:
Lower gold thickness (50 nm vs. 200 nm - EPIG, EPAG and DIG)
Resolve reliability concerns & field failures due to Electroless Nickel Immersion Gold (ENIG)
Eco-friendly solution: Cyanide-free rose-gold shine
Improves corrosion resistance by a factor of 10
No brittle failures at solder joints
Up to 40% savings in gold material consumption vs ENIG and ENEPIG
Adaptable to fit your existing assembly process
Conventional ENIG and ENEPIG assemblies suffer from several known issues:
Corrosion ("black pad" defects), non-wetting to solder
Brittle failures at solder joints, component breakage
Non-uniform gold thickness, more expensive and less reliable
Over-plating or skip-plating issues on PCBs
Leave behind the cyanide-based matte yellow finishes!
ENIG-Premuim™ PCB Surface Finish Demo
Improved reliability
with all the benefits of the traditional ENIG.
An Eco-friendly surface finish solution, while retaining all the benefits of the traditional ENIG processes.
Seamless adoption by any PCB manufacturer.
Our chemistry requires no change in base assembly processes.
Your process - Our Chemistry - Better Reliability
LiloTree received a Small Business Innovation Research (SBIR) grant from the National Science Foundation to develop ENIG-Premium
TM
to resolve the field failures where black pads and brittle failures at solder joints were found to be factors contributing to the malfunctioning of devices (NSF SBIR Phase I & II)
Contact us for more information or to qualify ENIG-PremiumTM for your electronic assemblies.
Other Services
Failure Analysis and Solution:
We provide root cause identification to every malfunctions and failures experienced by customers' parts or components.
Quality Compliance:
Our scientists will provide quality compliance testing for wide range of products from various industries.
Manufacturing consultation:
We provide support for all aspects of product development cycle: R&D, Manufacturing, Quality Compliance and Failure Analysis.
Lilotree:
2904 266th Ave NE,
Building B,
Redmond WA 9803-2936
Corrosion ("black pad" defects), non-wetting to solder
