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LiloTree is an advanced materials technology company, providing next-generation technology solutions through chemistry and materials innovations. Based in Seattle, Washington, we're an NSF funded company, manufacturer & distributor of ENIG-PremiumTM, an eco-friendly patented solution offering enhanced reliability at lower cost.
Since our roots, Lilotree has set out to provide exceptional products and customer support. We're a team of passionate scientists and industry specialists, working to create next-generation solutions backed by our commitment of service and support. Today we are confident our experience and innovations will give you the results you need to bring your products to the next level.
| Your process - Our Chemistry - Better Reliability
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LiloTree received 2019 Best of Redmond Award in the Manufacturer category
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LiloTree received a Small Business Innovation Research (SBIR) grant from the National Science Foundation to develop ENIG-Premium to resolve the field failures where black pads and brittle failures at solder joints were found to be factors contributing to the malfunctioning of devices (NSF SBIR Phase I & II)
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Manufacturing in US (Washington State)
Agile in filling purchase orders
Fully functional & comprehensive scientific lab in-house
Team of experienced application engineers
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Media Archive
Click on any of the links below to see older newsletters, flyers, brochures, and published papers from conferences.
Newsletters:
- Dec 2020, Attend ECWC15 2020 Virtual Conference Presentation: Reliable Nickel-free Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
- Nov 2020, Optimum Performance and High Reliability At a Lower Cost: Nickel-Less ENIG-Premium
- Join us at Del Mar Tradeshow Webinar: ENIG-PREMIUM: Surface Finish For Better Reliability Of Electronic Assemblies
- Oct 2020, Attend IWLPC 2020 Virtual Conference Presentation: Novel Surface Finish for Next Generation Wafer Level Packaging Applications
- Sept 2020, Attend SMTA International 2020 Virtual Conference Presentation: Nickel-Free Surface Finish Solution FOR 5G, RF, Microwave, High-Frequency-HDI PCB Applications
- Aug 2020, LiloTree Surface Finishes: For Optimum Performance and Better Reliability
- July 2020, Award-winning Ni-less ENIG-Premium Plating Services: Ideal solution for HDI, High Frequency, RF, Microwave PCBs/Semiconductors
- June 2020, Join us at Del Mar Tradeshow Webinar: NI-LESS ENIG-PREMIUM: Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-MICROWAVE, HIGH FREQUENCIES
- May 2020, ENIG-Premium: Better Reliability at Lower Cost
- Apr 2020, Lilotree and COVID-19: Showcasing support during COVID-19
- Mar 2020, Are You Ready for High-Frequency Applications?: Ni-less ENIG-Premium offers optimum performance for 5G HDI PCBs
- Feb 2020, Join us for IPC Wisdom Wednesday Webinar: Role of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
- Jan 2020, Catching up with Lilotree at IPC APEX 2020: LiloTree showcases Award-Winning Ni-less ENIG-Premium surface finish
- Nov 2019, Ready for 5G? Ni-less ENIG-Premium offers optimum performance for 5G-HDI PCB applications
- Oct 2019, LiloTree to take center stage at IPC Electronics Material Forum 2019: to talk about our ground breaking solution, Ni-less ENIG-Premium for 5G-HDI PCB applications
- Sept 2019, Product Spolight - Ni-Less ENIG-Premium: Ni-less ENIG-Premium specifically designed for HDI, 5G, high frequency, RF applications
- Aug 2019, ENIG-Premium solution to black pads: ENIG-Premium is the surface finish solution which resolves ENIG's "black pad" problem
- Jul 2019, Product Spotlight - LILO-Pretreat: A multi-purpose solution which performs all of the traditional pre-treatment processes with only one solution! Designed to save manufacturing resources.
- Jun 2019, Product Spotlight - LILO-BL: A corrosion inhibitor barrier layer which is nanoengineered to help prevent corrosion on Nickel surfaces
- Jan 2019, Special Bulletin - liloTree at APEX 2019: Ten-fold corrosion resistant and cost-effective ENIG-Premium
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Interviews, Press Releases:
- July 2020, Products Finishing Magazine: LiloTree Provides Corrosion Resistance for Nickel Plating
- June 2020, IPC Blog: Solving the Surface Finish Selection Paradox
- May 2020, Innovations for the Finishing Industry, Products Finishing: LiloTree's Lilo-BL Increases Corrosion Protection
- Feb 2020, "I-Connect REAL TIME" LiloTree Interview: Award Winning Technical Paper
- Feb 2020, I-Connect REAL TIME IPC APEX EXPO 2020 SHOW & TELL MAGAZINE: Took top honors and was awarded “Best of Show” at the 2020 IPC APEX EXPO technical conference
- Jan 2020, IPC Blog: Where Can you Find a Suitable Surface Finish for 5G, High Frequency, and High-Density Applications?
- Jan 2020, Best Technical Papers at IPC APEX EXPO 2020 Selected: LiloTree's received the top honor!
- Dec 2019, US-Tech magazine: Increasing signal integrity in HDI, 5G, High-Frequency PCBs
- Dec 2019, Looking Back on IPC’s First Annual Electronics Materials Forum, I-Connect007: Talks about LiloTree's approach to develop surface finishes
- Oct 2019, Press release: LiloTree Receives 2019 Best of Redmond Award in the Manufacturer category
- Jan 2019, "I-Connect REALTIME" LiloTree Interview: ENIG-Premium designed to eliminate black pad and corrosion
- Nov 2018, "SMTAI REALTime" LiloTree Interview: Hyper Corrosion, Black Pad in ENIG
- Groundbreaking Developments at liloTree, I-Connect007: ENIG-Premium eliminates black pad and brittle solder joints
- Circuitnet
- Viewpoint 2020: Ni-less ENIG-Premium - A surface finish for 5G, high frequency, high density applications
- Press Release: LiloTree wins Best Paper at IPC APEX 2020
- White Paper: Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
- White Paper: A Novel ENIG Surface Finish for Robust Solder Joints
- Press Release: Cost-Effective & Eco-Friendly Ni-less Surface Finish Solution Designed for HDI, 5G, High Frequency, RF PCB applications
- White Paper: An Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Assemblies
- Press Release: Cost-Effective Eco-Friendly ENIG Solution to address black pad failures and brittle solder joints
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Exhibits, Conferences, Webinars, Published Papers:
- ECWC15 2020: Reliable Nickel-free Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
- IWLPC 2020: Novel Surface Finish for Next Generation Wafer Level Packaging Applications
- Del Mar Tradeshow Webinar, 2020: ENIG-PREMIUM: Surface Finish For Better Reliability Of Electronic Assemblies
- SMTAI 2020: Nickel-Free Surface Finish Solution FOR 5G, RF, Microwave, High-Frequency-HDI PCB Applications
- Sur/Fin 2020: Exhibit - Canceled due to COVID-19
- Del Mar Tradeshow Webinar, 2020: NI-LESS ENIG-PREMIUM: Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-MICROWAVE, HIGH FREQUENCIES
- IPC High Reliability Forum 2021: Canceled due to COVID-19
- IPC Wisdom Wednesday Webinar, 2020: Role of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
- IPC 2020: Reliable Nickel-Free Surface Finish Solution for High-Frequency-HDI PCB Applications
- IPC Electronics Materials Forum 2019: Reliable and cost-effective Nickel-free solutions for high-frequency/high-density applications
- SMTAI 2019: Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
- Sur/Fin 2019: Exhibit - Surface finishes for Better Reliability
- IPC 2019: A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
- SMTAI 2018:A Novel & Cost-effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
- IPC 2018: A Novel Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
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Lilotree:
2904 266th Ave NE,
Building B,
Redmond, WA 98053-2936 |
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