Nanocleaner & Lilo-Pretreat

Ni-less ENIG-PremiumTM 
Nickel-Free Surface Finish Solution for HDI, 5G, High Frequency, RF PCBs

Tremendous growth in mobile phones/devices, 5G network has led to enormous increase in amount of data transfer.

For HDI, high frequency applications, high speed electronic signals are necessary in PCBs. To achieve the optimum performance and reliability LiloTree has launched revolutionary, unparalleled solution: Ni-less ENIG-Premium.

Ni-less ENIG-Premium

  Nickel-less solution: Low insertion loss

 High reliability: No brittle failures at solder joints (including Lead-free)

 Long shelf life: Au based surface finish

 Cost-effective: Lower gold thickness 

(50 nm vs. 200 nm - EPIG, EPAG and DIG)

 Eco-friendly solution: Cyanide-free & RoHS compliant

ENIG-Premium (Patented)
Reliability with a rose-gold shine 

Resolve reliability concerns & field failures due to Electroless Nickel Immersion Gold (ENIG) 
   Eco-friendly solution: Cyanide-free rose-gold shine 
  ENIG-Premium Black Pad Newsletter Improves corrosion resistance by a factor of 10 
   No brittle failures at solder joints 
   Adaptable to fit your existing assembly process
   Up to 40% savings in gold material consumption vs ENIG and ENEPIG 

Conventional ENIG and ENEPIG assemblies suffer from several known issues: 
   Corrosion ("black pad" defects), non-wetting to solder 
   Brittle failures at solder joints, component breakage 
   Non-uniform gold thickness, more expensive and less reliable 
   Over-plating or skip-plating issues on PCBs 

Leave behind the cyanide-based matte yellow finishes!

ENIG-Premuim™ PCB Surface Finish Demo

Improved reliability with all the benefits of the traditional ENIG.
An Eco-friendly surface finish solution, while retaining all the benefits of the traditional ENIG processes.
Seamless adoption by any PCB manufacturer. Our chemistry requires no change in base assembly processes.

Your process - Our Chemistry - Better Reliability

  LiloTree received a Small Business Innovation Research (SBIR) grant from the National Science Foundation to develop ENIG-Premium to resolve the field failures where black pads and brittle failures at solder joints were
found to be factors contributing to malfunctioning of devices (NSF SBIR Phase I & II)
LiloTree received 2019 Best of Redmond Award in the Manufacturer category

Manufacturing in US (Washington State) 

Agile in filling purchase orders 

Fully functional & comprehensive scientific lab in-house 

Team of experienced application engineers 

Contact us for more information or to qualify ENIG-PremiumTM for your electronic assemblies.
Other Services
Product Improvement Solutions 
Product Improvement Solutions 
Product Improvement Solutions 
Failure Analysis and Solution: We provide root cause identification to every malfunctions and failures experienced by customers' parts or components.
Quality Compliance: Our scientists will provide quality compliance testing for wide range of products from various industries.
Plating Service: We provide customized plating services - Quick turnaround - High tech capabilities - Superior quality.
2904 266th Ave NE, 
Building B, 
Redmond WA 98053-2936