Exhibits, Conferences, Webinars, Published Papers:
SMTA International 2022: Selection Criteria of Surface Finish for Next-Gen PCB Technologies for HDI, High-Frequency, RF-Microwave, 5G
EIPC Technical Snapshot Webinar 2022: Novel Ni-free surface finish for next generation PCB technologies
Decarbonisation Expo 2022: LILOTREE LLC - Exhibitor Details (fcexpo.jp)
IPC APEX Expo 2022: Compatibility Evaluation of Environmentally Friendly Additive Inkjet Coating and Plating Chemistry
SMTA Puget Sound Chapter Webinar 2021: Selection Criteria of Surface Finish for Next-Gen PCB Technologies
IPEHET 2021: Reliable and Cost-Effective Nickel-Free Surface Finish Solution for High-Frequency/High-Density PCB Applications
IPC APEX Expo 2021: Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
EIPC Technical Snapshot Webinar 2020: Novel eco-friendly Ni-free surface finish for high speed-high frequency PCB applications to attain optimum performance and better reliability
ECWC15 2020: Reliable Nickel-free Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
IWLPC 2020: Novel Surface Finish for Next Generation Wafer Level Packaging Applications
Del Mar Tradeshow Webinar, 2020: ENIG-PREMIUM: Surface Finish For Better Reliability Of Electronic Assemblies
SMTA International 2020: Nickel-Free Surface Finish Solution FOR 5G, RF, Microwave, High-Frequency-HDI PCB Applications
Sur/Fin 2020: Exhibit - Canceled due to COVID-19
Del Mar Tradeshow Webinar, 2020: NI-LESS ENIG-PREMIUM: Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-MICROWAVE, HIGH FREQUENCIES
IPC High Reliability Forum 2021: Canceled due to COVID-19
IPC Wisdom Wednesday Webinar, 2020: Role of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
IPC APEX 2020: Reliable Nickel-Free Surface Finish Solution for High-Frequency-HDI PCB Applications
IPC Electronics Materials Forum 2019: Reliable and cost-effective Nickel-free solutions for high-frequency/high-density applications
SMTA International 2019: Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
Sur/Fin 2019: Exhibit - Surface finishes for Better Reliability
IPC APEX 2019: A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
SMTA International 2018: A Novel & Cost-effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
IPC APEX 2018: A Novel Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies